Leading external storage manufacturer LaCie and renowned quiet cooling specialist Noctua today announced their cooperation on the development of acoustically optimized storage solutions. The recently announced LaCie 4big Quadra and LaCie 5big Network, designed by Neil Poulton, are the first LaCie four and five-bay RAID external storage solutions to feature Noctua cooling technology. Thanks to the use of Noctua's NF-P12 fan, their noise emission is reduced, on average, by 40% compared to their predecessors.

"LaCie always seeks to combine class-leading performance with design and ergonomics", said Olivier Mirloup, LaCie Hard Disk Solutions Business Unit Manager. "Offering capacities up to 6TB and 7.5TB respectively and a versatile hot-swap feature, LaCie 4big Quadra and LaCie 5big Network support seven RAID modes for optimal performance and data protection. Furthermore, we wanted our products to become the reference in terms of quietness for professional storage. That's why we've chosen Noctua's award-winning NF-P12 fan for cooling, and we are very proud of the result. It's a vast improvement."

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Whether you're rescuing hostages, on a quest with your guild or saving humanity, you don't want to worry about hand fatigue or hitting the wrong key. Today, Logitech introduced the Logitech G13 advanced gameboard – a hybrid gaming keyboard designed to complement your Logitech keyboard and mouse – giving you game-changing comfort and control on a Mac computer or a PC.

"If you're into serious gaming, there's no better feeling than playing with the G13 gameboard by your side," said Ruben Mookerjee, Logitech's director of product marketing for gaming. "Unlike other gameboards that focus only on programmability, the G13 advanced gameboard incorporates the principles of our award-winning Comfort Wave design. So whether you're getting into World of Warcraft or walking into your next LAN party, the G13 gameboard gives you a powerful advantage over those forced to work with less."

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Patriot Memory, a global provider of premium quality memory module and flash memory solutions, today announced their award-winning Xporter XT Boost USB flash drive now comes with improved read speeds of up to 200x. Previously, the Xporter XT Boost read speeds were rated up to 180x. The new Xporter XT still remains available in 2/4/8/16/32 gigabyte capacities and is still Microsoft Windows certified for Vista ReadyBoost.

"In keeping in-line with our cutting edge philosophy, we are updating our already blazingly fast Boost series, giving the consumers an even better value." says Meng Jay Choo, Flash Product Manager for Patriot Memory. "Consumers will see a noticeable difference when using the new Xporter XT Boost. The 20x increase in read speed from the previous generation of the Xporter XT Boost equates to 3MB/s. This means more time to enjoy your pictures or videos rather than waiting for them to open.

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NVIDIA Corporation announced its full support for the newly released OpenCL 1.0 specification from the Khronos Group. OpenCL (Open Computing Language) is a new compute API that allows developers to harness the massive parallel computing power of the GPU. The addition of OpenCL is another major milestone in the GPU revolution that gives NVIDIA developers another powerful programming option.

NVIDIA kicked off the GPU computing revolution with the introduction of NVIDIA CUDA, its massively parallel computing ISA and hardware architecture. CUDA was designed to natively support all parallel computing interfaces and will seamlessly run OpenCL. Enabled on over 100 million NVIDIA GPUs, CUDA has unleashed unprecedented performance boosts across a wide range of applications and provides a huge installed base for the deployment of compute applications using OpenCL. With support for other industry standard languages such as C, Java, Fortran and Python, only the CUDA architecture provides developers with a choice of programming environments to aid the rapid development of compute applications on the GPU.

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You can use your laptop anywhere in your home. But what you gain in mobility, you often sacrifice in comfort. To address this pain point, Logitech (SIX LOGN) (NASDAQ LOGI) today introduced the Logitech® Comfort Lapdesk for Notebooks – the newest addition to the company's line of notebook accessories. The Comfort Lapdesk provides a stable base and helps protect against laptop heat whether you're working from the comfort of your couch, relaxing on your bed or reclining on the living-room floor.

"While other lapdesks promise improved comfort, they often fall short because of poor design and low-quality materials," said Denis Pavillard, Logitech's vice president of product marketing for keyboards and desktops. "The new Logitech lapdesk has a thoughtful design that will help make your laptop experience more comfortable, wherever you use your computer."

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After winning countless praise and awards for the DDR3 1800 and DDR3 2000 modules, the Xtreem DDR3 tri-channel module from Team has become the key of the next-gen Core i7 platform. In memory architecture, the Core i7 has enhanced the frequency from DDR3 1333 to DDR3 1866. In addition to increasing the speed by nearly 30%, the tri-channel layout has an expanded bandwidth to 44GB/Sec for the Team Xtreem DDR3 1866 to exert its "market-fastest" advantage. The Xtreem Dark DDR3 1600 and DDR3 1333 are low-latency models in 8-8-8-24 and 7-7-7-21 timings (tCL-tRCD-tRP-tRAS) respectively on 1.65V. These have displayed Team's unrivaled R&D capacity.

All Xtreem DDR3 tri-channel modules from Team are made with genuine BGA chips in 128x8 configurations. They are available in 6GB (3 x 2GB) and 3GB (3 x 1GB) kits to meet the capacity needs of different users. A tradition of Team, all tri-channel memory modules are produced in under strict quality control and must pass vigorous tri-channel tests before shipping to ensure that every module has excellent, stable and reliable performance. Also, Team has equipped them with brand-new, fashionable black aluminum heatsinks which present an exquisite appearance with the unique X-shaped type design to mark out the eXtreme performance of the product.

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A-DATA Technology, a worldwide leader in high performance memory products, announced today that it is launching A-DATA XPG DDR3-2133X v2.0 of its X Series. These high-performance modules run at incredible 2133MHz with CL10-10-10-30 timings and are available in 1GBx3/2GBx3 triple-channel as well as 2GB/4GB dual-channel module kits.

A-DATA XPG DDR3-2133X v2.0 is engineered with heavy Aluminum heatspreaders and an additional dual-fan unit, keeping the RAMs cool. A-DATA combined two methods of heat dissipation to maximize the OC performance for its entire X Series Version 2.0.

Over the years, A-DATA has built a reputation for consistently high quality. To ensure stable operation over extended periods of usage, the X Series Version 2.0 performs rigorous testing and screening on all components to select only the best for the X Series modules.

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DisplayLink and Acer today announced the availability of a new Windows Vista Aero-compatible USB computer monitor, with integrated DisplayLink technology. The 22-inch B223 screen, part of Acer's ergonomic B series family of monitors, is now shipping in Europe. With 1680x1050 widescreen resolution, Acer's new display has integrated USB ports to facilitate multiple displays easily. Using DisplayLink's DL-160 network display chip, up to six Acer B223 monitors can be connected to a single PC or laptop, via a standard USB 2.0 connection.

DisplayLink's plug-and-play technology enables quick and simple one step set-up, and a five millisecond response time eliminates latency and ensures exceptional performance across multiple screens.

"At Acer, we're committed to enhancing our customers' viewing experience and mobility, and we realise that different types of users want different features and functionality from their monitors," said Oliver Ahrens, Product Business Director at Acer. "By adding DisplayLink's USB technology to our popular 22-inch displays, we're making it easy and cost-effective for computer users to add extra screens. Building on our expertise with the B series, this new addition is ideal for businesses that need to carry out document comparison activities, or put together complicated presentations, or indeed any other image- or text-intensive computer task."

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With the growing performance from multi-core processors and population of virtualization, entry and middle-range servers based on dual processors platform provide the power and versatility required for front-end servers as well as for high performance computing.

Given versatile applications desirous for much more memory capacity, designed for AMD Opteron platform, GIGABYTE GA-3CESL-RH2 features 16 DIMM (8 DIMM for each processor) supporting maximum 64GB registered DDR2-800/667/533 memory.

Being successor of well-reputed GA-3CESL2-RH server board and loaded with dual AMD Opteron 2000 series processors, systems built on GA-3CESL2-RH let users enjoy the performance advantage from Direct Connect Architecture (HyperTransport) and receive the benefits of 64-bit computing while getting the best 32-bit performance available anywhere. 6 SATA ports, RAID 0/1/5 mode provided by NVIDIA nForce Professional 3600 MCP and optional SAS RoC feature enabled to fill the needs of most internal RAID installation securing platform availability and data safety.

Besides the die shrink to 45nm process, “Shanghai” enjoys advantages based on higher frequency bump, HyperTransport Technology 3.0 up to 17.6GB/s, increased L3 cache capacity, more memory bandwidth, Smart Fetch reducing 21% power savings, improved data integrity from “L3 cache index disable” designed to protect data against L3 cache errors, enhanced virtualization by RVI (Rapid Virtualization Indexing) for up to 25% faster “world switch” time, and last but not least, 20-30% performance improvement over 65nm Quad-core Opteron “Barcelona”. All power efficiency innovations improve power consumption during idle: up to 35% lower power per processor, and up to 12% lower power at platform-level.

With the introduction of new generation AMD Opteron Processors and GA-3CESL2-RH, upcoming GIGABYTE Opteron servers and workstations will bring customers enhanced power efficiency, advanced virtualization technology, and future many-core upgradeability provided by AMD’s innovation.

Since the first product exposure in June this year, Spedo has been expected to reform the global PC chassis market. It is the 2008 masterpiece of the famous Thermaltake engineering and technical skills. The unique style and structure of Spedo was inspired by the design of European sports cars offering superior aerodynamics, Thermaltake Spedo was created to satisfy your hunger for the perfect integration of style and enhanced ventilation with user convenience!

It is not just the stylish expression of Spedo that spoke for the product it is also the unique internal structure that made it shine out from other PC cases on the market:

• C.R.M.3 – Cable Routing Management 3, arranging cables with exclusive plastic covers behind the motherboard, this provides a well-organized internal setting to boost up the air circulation with no messy cable blockage.

• A.T.C.3 – Advance Thermal Chamber 3, following the concept of automotive engine bay designs, the internal structure of SPEDO has been separated into 3 chambers, isolating the CPU, GPU and PSU areas by specially made partitions.

• Fancool 8, capability of up to 8 fans support including the 23cm fans at top and side panel that further enhance the system airflow.

After many media recommendations, the CES 2009 Innovations Award announced today has proved the design and engineering excellence of Thermaltake Spedo. It will be displayed at the 2009 International CES, which runs January 8-11, 2009 in Las Vegas, Nevada. The Innovations Design and Engineering Showcase will feature honorees by product category at the Sands Expo and Convention Center/The Venetian, Booth #72062. Best of Innovations honoree products will also be displayed at the Grand Lobby of the Las Vegas Convention Center, next to Experience CEA and at CES Unveiled: The Official Press Event of the International CES on Tuesday, January 6.

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